Comprehensive Circuit Board Basics
Page Introduction
Classification
|
Circuit board,PCB,
|
Keyword
|
circuit board,circuit board basics,type of circuit board,how does circuit board work;circuit board manufacturers
|
Article core
|
Comprehensive Circuit Board Basics
|
Catalogs
Catalogs
|
I.What is circuit board
|
II.How Circuit Board Works
| |
III.PCB board material
| |
· 1.Paper-based print circuit board
| |
· 2. Epoxy glass fiber fabric print circuit board
| |
· 3.Composite substrate print circuit board
| |
· 4.Special substrate
| |
· 5.PCB substrate - copper clad plate
| |
IV.The Types of Circuit Board
| |
· 1.Single-Sided Boards
| |
· 2. Double-Sided Boards
| |
· 3.Multi-layer Boards
| |
V. Circuit Borad Components
| |
VI. PCB Design Process
| |
· 1. The basic design process of the circuit board
| |
· 2. The design process of circuit schematic diagram
| |
· 3. Size, direction, and color of the PCB circuit drawings
| |
· 4. Setting up grid and cursor
| |
VII. TOP 10 Printed Circiut Board Manufacturers in the World
|
I.What is circuit board
The name of the circuit board is: ceramic circuit board, alumina ceramic circuit board, aluminum nitride ceramic circuit board, circuit board, PCB board, aluminum substrate, high frequency plate, thick copper plate, impedance board, PCB, ultra thin circuit board, ultrathin circuit board, printing (copper etching technology) circuit board, etc. The circuit board makes the circuit miniaturized and intuitionized, and plays an important role in the batch production of the fixed circuit and the optimization of the layout of the electrical apparatus. The circuit board can be called a printed circuit board or printed circuit board, English name (Printed Circuit Board), PCB (Flexible Printed Circuit board (FPC) FPC circuit board circuit board and flexible circuit board flexible circuit board is made of polyimide or polyester film as a base material with high reliability, excellent flexibility printed circuit board. It has the characteristics of high density, light weight, thin thickness and good bending. With the birth and development of reechas (Soft and hard combination plate) -FPC and PCB, the new product is produced by the soft and hard combination board. Therefore, the hard and soft panel is flexible circuit board and rigid circuit board, after compression and other processes, according to the relevant process requirements to form a FPC board with PCB characteristics.
Making your own printed circuit board can be a truly satisfying process, tying together electronics and the handmade craft of etching. It's the most accurate way to build a
circuit short of sending away to a PCB manufacturer and it's a lot more fun.
II.How Circuit Board Works
Open up a television or a radio and you'll see it's built around a printed circuit board (PCB): a bit like an electric street-map with small electronic components (such as resistors and capacitors) in place of the buildings and printed copper connections linking them together like miniature metal streets.
III.PCB board material
- 1.Paper-based print circuit board
 |
Paper-based print circuit board
|
The substrates used for this printed circuit board are made of fiber paper as reinforcing material, and then dipped in resin solution (phenolic resin, epoxy resin, etc.) after drying. The electrolytic copper foil coated with glue is pressed by high temperature and high pressure. According to the standard of ASTM/NEMA (American National Standard Association / American electric Manufacturers Association), the main varieties are FR-1, FR-2 and FR-3 (the above are flame retardant XPC and XXXPC (above is non flame retardant). More than 85% of the global paper based printed board market is in Asia. FR-1 and XPC PCB are the most commonly used and large quantities of production.
- 2. Epoxy glass fiber fabric print circuit board
 |
Epoxy glass fiber fabric print circuit board
|
The substrate used in this type of printed board is epoxy or modified epoxy resin as adhesive, glass fiber cloth as an reinforcing material. This type of printed board is the largest type of printed board in the world, which is the largest and most used in the world. In the ASTM/NEMA standard, epoxy glass cloth has four types: G10 (flame retardant), FR-4 (flame retardant); G11 (heat retention strength, flame retardant), FR-5 (retention of heat intensity, flame retardant). In fact, non flame retardant products are decreasing year by year, and most of them are FR-4.
- 3.Composite substrate print circuit board
 |
Composite substrate print circuit board
|
The material and core of the base material used in this type of printed board are made up of different reinforcing materials. The base material used for copper cladding is mainly the CEM (composite epoxy material) series, with the most representative of CEM-1 and CEM-3. CEM one 1 base material is fiberglass cloth, core material is paper, resin is epoxy, flame retardant, CEM-3 base material is fiberglass cloth, core material is glass fiber paper, resin is epoxy, flame retardant. The basic characteristics of the composite base printed board are equivalent to the FR-4, and the cost is low, and the mechanical processing performance is better than that of FR-4.
- 4.Special substrate
Metal material (aluminum, copper, iron and steel, invar) Tao Ci base, according to its characteristics, use can be made of metal (Tao Ci) based on single and double, multilayer printed circuit board or metal core printed board.
From the beginning of twentieth Century to the end of 1940s, it was the embryonic stage of the development of the PCB substrate material industry. Its development features are mainly reflected in the following aspects: at this stage, resins, reinforcement materials and insulation substrates are springing up, and preliminary exploration has been made in technology. All of these have created the necessary conditions for the development and development of the most typical substrate material used for printed circuit boards, copper clad plates. On the other hand, the PCB manufacturing technology based on the metal foil etching (Jian Chengfa) manufacturing circuit has been established and developed in the first place. It plays a decisive role in the determination of the structure and characteristic conditions of the copper clad plate.
The copper clad plate was actually used in PCB production, and first appeared in the PCB industry in the United States in 1947. The PCB substrate material industry has also entered its initial stage of development. At this stage, the manufacturing technology progress of raw materials, such as organic resins, reinforced materials and copper foil, will strongly push the development of substrate materials industry. Because of this, the manufacturing technology of substrate materials is beginning to mature step by step.
- 5.PCB substrate - copper clad plate
 |
PCB substrate - copper clad plate
|
With the invention and application of integrated circuits, the miniaturization and high performance of electronic products, the PCB substrate material technology has been put on the track of high performance development. The rapid expansion of the demand for PCB products in the world market has made the production, variety and technology of PCB substrate materials developed rapidly. At this stage, a wide new field of multilayer printed circuit boards (PCB) has emerged in the application of substrate materials. At the same time, the substrate material in this stage is more diversified in structure composition. At the end of the 1980s, portable electronic products, such as notebook computers, mobile phones and video cameras, began to enter the market. These electronic products are developing rapidly towards miniaturization, lightweight and multi-function, which greatly promote the development of PCB towards micro holes and fine wires. Under the changing demand of the PCB market, a new generation of multilayer boards, the multilayer multilayer board (BUM), which can be used for high density wiring, came out in 1990s. The breakthrough of this important technology has also made the substrate industry into a new phase of the development of a high density interconnect (HDI) multiplate substrate. In this new stage, the traditional copper clad technology has been challenged. PCB substrate material has new changes and new creation in manufacturing materials, production varieties, substrate structure, performance characteristics and function of products.
IV.The Types of Circuit Board
The circuit board system is classified into three types:
- 1.Single-Sided Boards
 |
Single-Sided Boards
|
- 2. Double-Sided Boards
 |
Double-Sided Boards
|
Both sides of the circuit board have wiring. But to use the two sides of the wire, it is necessary to have a proper circuit connection between the two sides. The "bridge" between these circuits is called the guide hole (via). A guide hole is a small hole in the PCB, filled with or coated with metal, which can be connected to the two sides of the wire. Because the area of double sided panels is twice as large as that of single panels, and because wiring can intersate (which can be wound to the other side), it is more suitable for circuits that are more complex than single panels.
- 3.Multi-layer Boards
 |
Multi-layer Boards
|
Inner line
The copper foil substrate is cut into the size suitable for processing production. The substrate film usually need to use the brush before grinding, micro etching methods such as surface roughening of copper foil as appropriate, then the temperature and pressure of the dry film photoresist attached on the seal. The paste dry film photoresist substrate into the ultraviolet exposure machine exposure, ultraviolet light resistance in negative transmission region will produce polymerization (dry film in the region in the later development, copper etching step is preserved as etching resist), and the negative image transfer to line dry film photoresist on the surface. After removing the protective film on the membrane surface, first remove the area which is not illuminated on the film surface with sodium carbonate solution, then remove the bare copper foil with the mixture of hydrochloric acid and hydrogen peroxide, and form the line. Finally, with the sodium hydroxide solution of dry film photoresist will retire after winning merit in addition to washing. For the six layer (including) more than the inner circuit board to automatically locate the punching machine out of the interlayer line opposite the riveting reference hole.
In order to increase the area that can be wired, the multi-layer board uses more single or double-sided wiring boards. The multi-layer plate uses a number of double-sided plates and sticky (pressed) after each laminate is placed in a layer of insulating layer.
The number of layers of the board represents a few layers of separate layers, usually even the number of layers, and contains the most lateral two layers. Most of the motherboards are 4 to 8 layers, but it is technically possible to do nearly 100 layers of PCB. Large scale supercomputers mostly use quite many layers of motherboards. However, because such computers have been replaced by clusters of many common computers, super multilevel boards have been gradually unused. Because of the close combination of the layers in the PCB, it is generally not easy to see the actual number, but if you look carefully at the motherboard, you may see it.
The automatic detection technology of the circuit board is applied with the introduction of the surface mounting technology, and the packaging density of the circuit board is increased rapidly. Therefore, even for the low density and general number of PCB, the automatic inspection of the circuit board is not only basic, but also economical. In the complex circuit board test, two kinds of common method is the testing method and double probe or flying probe testing method.
V. Circuit Borad Components
The common electronic components on the circuit board of electronic components generally include component classes, device classes and combination classes.
- 1, component classes: there are resistors, capacitors, inductors, crystal oscillators, ceramic filters, mechanical switches, connectors, simple sensors (such as thermistors).
- 2, device class: mainly diode, triode, thyristor, integrated circuit, simple sensor (such as photosensitive diode, triode) and so on.
- 3, combination: there are various modules, complex sensors, and so on.
There are many categories of electronic components:
1) the classification of electrical energy can be divided into component classes, device classes and combinatorial classes according to the need for independent supply of electrical energy.
2) according to the classification of the package, it can be divided into plug-in class and patch class.
3) according to the classification of dissipative power, it can be divided into high-power components, medium power components, small power components and micro power components, and so on.
VI. PCB Design Process
 |
PCB Design Process
|
- 1. The basic design process of the circuit board
The basic design process of the circuit board can be divided into four steps:
> The design of circuit principle diagram
The main design of the circuit schematic diagram is to draw the schematic diagram by using the principle diagram editor of Protel DXP.
> The generation of the network report
The network report is the link between display circuit principle and components of each of the statements, it is connected to the circuit principle diagram design and circuit board design (PCB design) of the bridge and the link, through the circuit principle diagram of the network statement, we can quickly find the connection between the components, so as to provide convenience for the design of the PCB.
> The design of printed circuit board
PCB design we usually refer to the design of printed circuit board, it is the final form of the circuit principle diagram into the design of this part of the design is circuit principle diagram is difficult, this part of the design of powerful design function we can use Protel DXP to complete.
> The formation of the printed circuit board table
After printed circuit board design is completed, it is necessary to generate various reports, such as generating pin report, circuit board information report, network status report, and finally print out the printed circuit diagram.
- 2. The design process of circuit schematic diagram
The design of circuit schematic is the basis of the design of the whole circuit. The design of the circuit directly determines the effect of the design of the rear PCB. Generally speaking, the design process of the circuit schematic diagram can be divided into seven steps:
> To start Protel DXP principle diagram editor
> The size and layout of the circuit principle diagram
> The removal of the required components placed on the working plane from the library
> According to the design needs to connect components
> The adjustment of wiring components
> It can save the principle diagram document has been painted
> Print the drawings
- 3. Size, direction, and color of the PCB circuit drawings
Drawing size, direction and color to achieve at the "Documents Options" dialog box, Design, Options command, you can open the "Documents Options" dialog box, you can set the drawing size, click the button in the Standard styles area, in the drop-down list box can choose A4~ OrCADE paper. The setting of the drawing direction is set through the Orientation option of the Options part in the Documents Options dialog box. Click the button, select Landscape, set the horizontal drawing, select Portrait, and set up the vertical drawing. The color of the drawing is set in the Options part of the drawing setup dialog box. Click Border Color color block, you can set the color of the picture border, click Sheet Color color block, you can set the base color of the drawing.
Execute the design--option -- change System Font, and play the "Font" dialog box. Through this dialog box, users can set the system font, set the font color, size and font.
- 4. Setting up grid and cursor
The setup grid and cursor are implemented mainly in the "Preferences" dialog box, and the "Preferences" dialog can be opened by executing the Tools to Preferences command.
Set grid: select the Graphical Editing tab in the dialog box, open the "Preferences" in the Cursor Grid Options Visible Grids (part of the display grid) bar, select Line Grid options for setting the linear grid, select Dot Grid options for the dot grid (grid).
Set cursor: select the Cursor Type (cursor type) option of Cursor Grid Options in the Graphical Editing tab. Under this option, there are three cursor types: Large Cursor90, Small Cursor90 and Cursor90. User can choose any cursor type.
VII. TOP 10 Printed Circiut Board Manufacturers in the World
Do you want to know what are the biggest bare printed circuit board manufacturing companies in the world? I have maked a table of pcb Manufactures in the world:
Acacia Research Corporation
|
Bare Printed Circuit Board Manufacturing, Semiconductor and Other Electronic Component Manufacturing, Electron Tube Manufacturing
|
AT&S India Pvt. Ltd.
|
Its parent company, AT&S AG is one of the most prominent PCB manufacturers in the world. And AT&S India has brought the expertise of its parent company with itself to the subcontinent. AT&S India is involved in the production of high volume PCB’s mostly for automobile manufacturers. Due to the scale of the company on the global stage, AT&S India is home to some of the most sophisticated machinery and assembly lines for manufacturing PCB’s. Apart from India, the company has its stations in five countries around the globe.
|
AVX Corporation
|
Bare Printed Circuit Board Manufacturing, Semiconductor and Other Electronic Component Manufacturing, Electron Tube Manufacturing
|
Benchmark Electronics
|
Bare Printed Circuit Board Manufacturing, Electronics manufacturing services
|
California Micro Devices Corporation
|
Bare Printed Circuit Board Manufacturing, Semiconductor and Other Electronic Component Manufacturing, Electron Tube Manufacturing
|
Comtech Group, Inc.
|
Bare Printed Circuit Board Manufacturing, Semiconductor and Other Electronic Component Manufacturing, Electron Tube Manufacturing
|
CTS Corporation
|
Bare Printed Circuit Board Manufacturing, Semiconductor and Other Electronic Component Manufacturing, Electron Tube Manufacturing
|
DDi Corp.
|
Bare Printed Circuit Board Manufacturing
|
Enova Systems Inc.
|
Bare Printed Circuit Board Manufacturing, Semiconductor and Other Electronic Component Manufacturing, Electron Tube Manufacturing
|
Flextronics
|
Bare Printed Circuit Board Manufacturing, Toy
|
Comments
Post a Comment